Lightmatter announced the Passage L200 co-packaged optics (CPO) product. It is designed to integrate with XPU and switch silicon designs and includes both 32 Tbps and 64 Tbps versions. This enables over 200 Tbps of total I/O bandwidth per chip package, significantly higher density than other announced CPO solutions.
AI data center interconnects face growing bandwidth and power challenges. Co-Packaged Optics (CPO) – integrating optics directly onto XPUs and switches – is the inevitable solution. Lightmatter’s bold approach delivers the essential elements of CPO and gives hyperscalers and chip manufacturers a path to deliver high-performance systems.
Andrew Schmitt, Directing Analyst
Source: Lightmatter Announces Passage L200, the Fastest Co-Packaged Optics for AI