Prior to ECOC 2018 Inphi introduced the industry’s smallest form factor, lowest power and highest performance 64GBaud quad coherent TIA and driver. Paired up as a chipset, the new TIA and Driver will enable higher density line cards and pluggable solutions that are critical for next generation 400/600G long haul, metro and data center interconnect (DCI) applications.

“Implementations of the upcoming 400ZR standard will require die-level TIAs and Drivers to fit into OSFP and QSFP-DD pluggable modules,” said Andrew Schmitt, lead analyst at Cignal AI.

“Having one supplier for both products gives a module or equipment manufacturer an advantage in development and time to market by reducing the variables in the design and easing bring-up and roll-out, something that is important in the fast-paced networking equipment industry.”